Built for clean, hot, and precise

Semiconductor fabs demand materials that stay dimensionally stable under heat and chemicals while minimizing particulate and ionic contamination. Machined Ultem® is widely used for nests, sockets, pick-and-place tooling, carriers, and electrical insulators thanks to its low CTE, high dielectric strength, and stiffness, all critical for repeatable alignment and signal integrity.

Industry references note adoption of Ultem® for wafer handling and chip-manufacturing fixtures where thermal stability and precision are indispensable. For miniaturized connectors and fine-pitch interfaces near the device under test, Ultem®’s low thermal expansion and high heat capability help maintain coplanarity and fit.

Parts Enplas machines for fabs & ATE

• Test sockets & nests with micro-features and vacuum ports
• End effectors, combs, carriers, and spacers for wafer handling
• Dielectric standoffs, coil/coil-former details, and shields inside tools
• Connector bodies & tails where low CTE improves pin alignment
  Ultem®’s Tg (~217 °C) supports thermal cycling and bake exposures typical of assembly and test flows.

How Enplas helps

As both an extruder of Ultem® stock and a precision machining house, Enplas controls material quality and geometry from billet to finished part. We provide:

• Lot-traceable shapes optimized for machining (reduced residual stress)
• Toolpath strategies for burr-free micro-features and flatness on thin plates
• Material guidance on unfilled vs. glass-reinforced Ultem® for stiffness and wear, and cleanliness considerations

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